Parameter
  • Curing Temerature (C)
  • Feature Size (microns)
  • Z-Axis Connection Resistance (mOhms)
  • X-Y Insulation Resistance (0hms)
  • Thermal Conductivity (W/m-k)

ZTACH ACE

  • 70-200 or UV
  • < 100
  • 7-20
  • >10
  • 3.5 – 7.3

No-Lead Solder

  • 250 – 340
  • < 50
  • < 7
  • < 10
  • 60 – 100

ACF

  • 130 – 150
  • > 150
  • 20 – 1000
  • > 10
  • 0.5 – 5
Parameter
  • Curing Temerature (C)
  • Feature Size (microns)
  • Z-Axis Connection Resistance (mOhms)
  • X-Y Insulation Resistance (0hms)
  • Thermal Conductivity (W/m-k)

ZTACH ACE

  • 70-200 or UV
  • < 100
  • 7-20
  • >10
  • 3.5 – 7.3

No-Lead Solder

  • 250 – 340
  • < 50
  • < 7
  • < 10
  • 60 – 100

ACF

  • 130 – 150
  • > 150
  • 20 – 1000
  • > 10
  • 0.5 – 5