Applications

ZTACH^® ACE addresses current interconnect technology manufacturing limitations for fine pitch applications that include sensitivity to pressure and/or high temperatures.  Manufacturing processing benefits of ZTACH^® ACE also include the elimination of solder bumping, underfill and co-planarity issues.   Performance benefits include reduced Silver Migration, increased Thermal Dissipation and high Thermal Post Cure Stability.  These features together with bonding reliability & package strength enables ZTACH^® ACE to address application challenges such as hybridized electronics, smaller form factors, 3-D Stacking and printed electronics.