Revolutionizing the Lead-Free Interconnection Marketplace
ZTACH® ACA addresses current interconnect technology manufacturing limitations for fine pitch applications that include sensitivity to pressure and/or high temperatures. Manufacturing processing benefits of ZTACH® ACA also include the elimination of solder bumping, underfill and co-planarity issues. Performance benefits include reduced Silver Migration, increased Thermal Dissipation and high Thermal Post Cure Stability. These features together with bonding reliability & package strength enables ZTACH® ACA to address application challenges such as hybridized electronics, smaller form factors, 3-D Stacking and printed electronics.