Press Releases

SunRay Scientific Wins National Innovation Challenge for ZTACH® Anisotropic Conductive Epoxy
SunRay Scientific Wins National Innovation Challenge for ZTACH® Anisotropic Conductive Epoxy

Mar 7, 2019 SEMI-FlexTech funds Flexible Electronics Project including SunRay Scientific Materials.
SEMI-FlexTech Funds New Cutting-Edge Projects For Flexible Electronics

News on SRS Products

Meet us ECTC | IEEE Electronic Components and Technology Conference: May 31- June 3, 2022 San Diego, California
Session 18: Emerging Technology Advancements in Applications and Processing – ECTC | IEEE Electronic Components and Technology Conference

Meet us at TechConnect World 2022: June 13-15, 2022 Washington, DC
Presenting paper Adhesive Offering Z-axis Conductivity, Stretchability and Manufacturing Scalability for LED Light Sheets

Meet us at Techblick Live: October 12 & 13, Eindhoven, Netherlands
The Future of Electronics RESHAPED

Awards and Recognition

  • 2022 – Dept of Defense, Air Force STTR Phase II Lightweight Interconnects for Dynamic FHE Aerospace Environments
  • 2022 – Dept of Defense, Air Force SBIR Phase II Advanced Unidirectional Compliant Electronic Interconnect for Reliable Ultrafine Pitch Microelectronic Systems
  • 2022 – TACFI with GE Research
  • 2021 – NextFlex P6.4 with Auburn U
  • 2020 – Dept of Energy, SBIR Phase I Elimination of Wire Bonding for Cryogenic Applications
  • 2020 – Dept of Defense, Air Force SBIR Phase II ZTACH ® ACE: Robust Interconnections for Military Wearable Sensors
  • 2020 – Dept of Defense, Air Force SBIR Phase I Advanced Unidirectional Compliant Electronic Interconnect for Reliable Ultrafine Pitch Microelectronic Systems
  • 2020 – Dept of Defense, Air Force STTR Phase I Lightweight Interconnects for Dynamic FHE Aerospace Environments
  • 2019 – Dept of Defense, Air Force SBIR Phase I Readout Integrated Circuit for Low Cost Infrared Focal Plane Arrays
  • 2018 – Dept of Energy, SBIR Phase II Enhanced Electronic Interconnects using ZTACH ACA: No Pressure, Low-Temperature, Self-Assembly Material Process
  • 2017 – Dept of Energy, SBIR Phase I High Density Chip Interconnect Technology