Interconnecting Your Future

Interconnecting Your Future

“Our application required a bonding process technology that was Low Temperature and Low Pressure.  We tried several methods to bond the ultrasonic transducer onto a flexible substrate.   None worked as well as the ZTACH® ACA material commercialized by SunRay Scientific”
“We see ZTACH® ACA being a key enabler for several of our ongoing in-house packaging efforts.” Steven Dooley, USA – Airforce Research Laboratory

Innovative Solutions

SunRay Scientific has created a suite of engineered solutions called ZTACH® ACA, an Anisotropic Conductive Adhesive which will enable manufacturers to use high throughput processes in flexible electronics assembly and deliver on the low cost promise of flexible electronics. Learn more about our solutions below.

Our Mission

We provide customized engineered solutions to meet your complex interconnect needs.

Our History

From our start in AT&T Bell Labs over 20 years ago, we have developed technology changing solutions and innovations.

Our Team

SunRay’s team is comprised of engineers and business leaders focused on bringing our technology to various industries.