Interconnecting Your Future

Interconnecting Your Future

“Our application required a bonding process technology that was Low Temperature and Low Pressure.  We tried several methods to bond the ultrasonic transducer onto a flexible substrate.   None worked as well as the ZTACH® ACE material commercialized by SunRay Scientific”
“We see ZTACH® ACE being a key enabler for several of our ongoing in-house packaging efforts.” Steven Dooley, USA – Airforce Research Laboratory

Innovative Solutions

Sunray Scientific offers custom engineered interconnect solutions for advanced electronic packaging. SunRay’s patented ZTACH® ACE electronically conductive epoxy system delivers cost effective miniaturization and improved throughput utilizing existing manufacturing infrastructure. Additionally, a new generation customized conductive inks, epoxies and encapsulants address challenges of silver migration, long-term durability, reduced processing requirements and improved device protection, to enable the next generation of printed electronics.

Our Mission

We provide customized engineered solutions to meet your complex interconnect needs.

Our History

From our start in AT&T Bell Labs over 20 years ago, we have developed technology changing solutions and innovations.

Our Team

SunRay’s team is comprised of engineers and business leaders focused on bringing our technology to various industries.