Consumer Applications

High-Performance Conductive Materials for Sensors & Instrumentation

Material Solutions by Application

RFID and Smart Tags

Fine pitch, bare die attach on RFID and other smart tag devices requires precise patterning, making standard ECA solutions difficult to manufacture and bond integrity is low. Solder is typically not an option due to processing limitation.  ACA or ACF require expensive termo bonding equipment which limits high volume throughput and increases cost.

SunRay’s Solution: ZTACH® ACE and UV ZTACH® ACE handle multiple pad bare die at pitch down to 100µm without patterning, offering up to a 5x increase in bond strength.  The UV cured solution can boost throughput by up to 80% when applicable.  With under 6% silver content, ZTACH® ACE can reduce cost per part by up to 50%.

Printed Flexible Hybrid Electronics (FHE)

Building complex, multifunction, flexible printed electronic devices involves using an SMT process to apply functional components onto printed circuitry. This often requires silver-filled ECAs, which require precise patterning, have low bond strength, and reduce manufacturing throughput.

SunRay’s Solution: ZTACH® ACE offers an anisotropic electrical component bonding solution that does not require patterning or thermo-binding pressure. It offers lower contact resistance and 5x improvement in bond strength over ECA, enabling fine pitch, high-density FHE assembly with little to no changes to existing SMT lines.  

Wearable Electronics

The wearable electronics market is growing, but bonding components to create higher-function FHE onto wearable films such as TPU remains challenging.  Temperature limitations and mechanical stress rule out conventional soldering, while ECAs introduce complications due to patterning requirements and weak mechanical connection. 

SunRay’s Solution: ZTACH® ACE is compatible with TPU due to its low-temperature processing capability and is readily adaptable to most conventional SMT lines.  Its high bond strength enables it to withstand the stretching and mechanical stress typical of wearable applications.  Compared with traditional ECAs, ZTACH® ACE’s low density and reduced silver content offer a potential for per-part cost reduction.

RFID Attach: ZTACH® ACE Validated Value Proposition

  • Manufacturing throughput drastically increased due to huge increase in number of component placements at one time, along with decrease in cycle times with UV cured solution results in 5-10x increases in manufacturing throughput
  • ZTACH® ACE contains less than 5% silver with a total density at 25% of traditional ACP materials, and it does not require encapsulation, thus a reduction in per unit cost
  • CapEx to manufacture is 25-50% less in most manufacturing environments
  • 3-4 days pot life versus 1-day with most ACP materials results in 3-4x reduction in waste, more efficient manufacturing
Learn about ZTACH® ACE

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