Automotive Applications
Fine-Pitch Solutions for High-Performance Automotive Electronics
Material Solutions by Application
High Density LED Attach
LEDs are becoming smaller and more powerful with a lower power draw. The need for high-density placement on flexible films is increasing, but fine-pitch placement at speed on low-temperature substrates remains difficult. Current methods require patterning, produce weak bonds, and are too slow for high-volume manufacturing.
High Performance Printed Sensors
Growth in printed automotive sensors is increasing pressure to reduce costs without sacrificing performance or reliability. Rising silver prices make this difficult, and lower-cost alternatives have yet to meet technical requirements.
SunRay’s Solution: FlexS™ silver ink delivers strong flexibility, environmental durability, and processing capabilities. An innovative manufacturing process reduces silver content by 15–20% relative to competitive materials while maintaining the same conductivity.
Die Attach for Optical Sensors
Growth in the EV market is increasing the need to reduce weight, space, and cost in automotive electronics without sacrificing performance or reliability. Current optical sensor attachment methods add bulk, take up space, and require multi-step processes.
SunRay’s Solution: ZTACH® ACE enables direct flip-chip bonding of unpackaged optical sensor die to flexible PCBs, delivering strong mechanical bonds, low insertion loss, and high optical signal strength. It reduces weight by up to 40%, size by up to 60%, and assembled package cost by up to 70%.
LED Ambient Light Panel: ZTACH® ACE vs Standard ECA
Enables a fully integrated printed electronics solution on lightweight, thin, and formable substrates. Two current projects to integrate high density, fine-pitch LED’s onto printed flexible circuitry validated the value proposition:
- Enables use of smaller LED's for less power consumption and more informed light output
- Elimination of patterning increases manufacturing yield
- More robust technology increased total reliability
- ~20% cost reduction compared to current ECA solution in use
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Engineered for the Road: High-Reliability Interconnects for EV & ADAS Systems
In the rapidly evolving landscape of Electric Vehicles (EV) and Advanced Driver Assistance Systems (ADAS), electronics must withstand extreme thermal cycling and constant mechanical vibration. Sunray Scientific provides specialized conductive adhesives and high-performance encapsulants designed to secure critical sensors, cameras, and power modules. Our ZTACH® ACA technology offers a low-temperature bonding alternative to traditional reflow soldering, protecting heat-sensitive components while ensuring robust electrical pathways. From battery management systems (BMS) to autonomous radar arrays, we deliver the material durability required for AEC-Q100 compliance and long-term vehicle safety.
Thermal Management & Ruggedization for Next-Gen Automotive Control Units
As automotive architectures move toward centralized compute and high-density power electronics, managing heat and structural integrity is paramount. Sunray Scientific’s thermal interface materials (TIMs) and structural epoxies are engineered to dissipate heat efficiently while providing superior moisture and chemical resistance. Our conductive inks and shielding materials enable the development of lightweight, flexible circuits for smart cockpits and haptic touch controls, reducing vehicle weight without sacrificing performance. By partnering with Sunray, automotive manufacturers can achieve higher production yields and develop ruggedized electronic control units (ECUs) that perform flawlessly in the most demanding road conditions.