ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution
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Enabled by the innovation of our ZMAG® Magnetic Pallet, ZTACH® ACE achieves z-axis particle alignment within 10 seconds to create an anisotropic electrical and mechanical bond between component and circuit.
- Fine-pitch interconnections down to 100μm
- 5-10x increase in bond strength
- No patterning or pressure required
- Reduced cost through low conductive particle loading
- Contact resistance between 7-20 mOh-cm
- Low temperature and UV cure options
- Broad substrate compatibility
- Easily adaptable into most SMT manufacturing lines
Conductive Column Formation
ZTACH® ACE conductive column formation within 10 seconds prior to cure.
BEFORE CURE
Randomly dispersed
particles
WITHIN 4 SECONDS
Particles align with
magnetic field exposure
WITHIN 10 SECONDS
Conductive columns
fully form
ZTACH® ACE Value Proposition
Design Benefits
- Reduced part complexity
- Thermal dissipation
- Self-underfilling
- Superior Adhesion
- Fine pitch down to 100 microns
Engineering Benefits
- No outgassing
- Environmentally Stable
- Rad and cryogenic stability
- RF performance up to 90GHz
- Low temperature and UV cure options
Manufacturing Benefits
- Easily adaptable to most SMT manufacturing lines
- Anisotropic without pressure
- Coplanarity not required
- No patterning
- Improved yields
- Higher manufacturing throughput
Our Fully Automated ZTACH® ACE SMT Process
ZMAG® Magnetic Pallet Enables ZTACH® ACE Process
- Easily integrated in a standard SMT process
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